Camera Module Hardware Engineer — Hands-on Bring-Up & Lab

tampere, manner suomi, Finland • Posted June 05, 2026

Job Type: Full-time
Location: tampere, manner suomi
Posted: June 05, 2026
Category: Electrical & Energy Engineering
Application Deadline: July 15, 2026

Role Description

A leading mobile technology firm in Tampere is seeking a Camera Module Hardware Engineer. This full-time consultant role will involve designing and testing camera module assemblies for next-generation smartphones. The successful candidate will have a Master's or PhD in electrical engineering and hands-on experience in electronics hardware engineering, PCB design, and soldering. Fluency in English and strong communication skills are essential. Competitive benefits, including occupational healthcare and team-building events, are offered.
#J-18808-Ljbffr

Interested in this role?

Click the button below to start your application for Camera Module Hardware Engineer — Hands-on Bring-Up & Lab at Huawei Finland R&D.

Apply Now