Electroplating & Wet Process Engineer - Yield & Quality

singapore, singapore, Singapore • Posted June 05, 2026

Job Type: Full-time
Location: singapore, singapore
Posted: June 05, 2026
Category: Other-General
Application Deadline: July 15, 2026

Role Description

UTAC in Singapore is seeking a technical professional to develop and optimize electroplating processes. Key responsibilities include monitoring plating performance, leading troubleshooting efforts, and collaborating with cross-functional teams for quality improvement. The ideal candidate holds a degree in Chemical Engineering or related fields, with preferred experience in semiconductor packaging and knowledge of plating chemistry. This role requires strong analytical skills and the ability to work in a cleanroom environment.
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