Electroplating & Wet Process Engineer - Yield & Quality
singapore, singapore, Singapore • Posted June 05, 2026
Job Type:
Full-time
Location:
singapore, singapore
Posted:
June 05, 2026
Category:
Other-General
Application Deadline:
July 15, 2026
Role Description
UTAC in Singapore is seeking a technical professional to develop and optimize electroplating processes. Key responsibilities include monitoring plating performance, leading troubleshooting efforts, and collaborating with cross-functional teams for quality improvement. The ideal candidate holds a degree in Chemical Engineering or related fields, with preferred experience in semiconductor packaging and knowledge of plating chemistry. This role requires strong analytical skills and the ability to work in a cleanroom environment.
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