Engineer (Plating/ Wet Process)

Singapore, Singapore, Singapore • Posted June 04, 2026

Job Type: Full-time
Location: Singapore, Singapore
Posted: June 04, 2026
Category: other-general
Application Deadline: July 14, 2026

Role Description

Responsibilities:


Plating Process Engineering

  • Develop, implement, and optimize electroplating processes (e.g., Cu, Ni, SnAg, etc.)
  • Monitor plating bath performance through regular analysis and corrective actions
  • Perform DOE, capability studies, and process qualification for new plating chemistry or equipment
  • Lead troubleshooting activities for plating defects such as voids, roughness, nodule formation, non-uniformity, and poor adhesion
  • Establish and maintain plating process parameters, SOPs, and control plans


Wet Process Support (Etching, Cleaning, Stripping)

  • Support wet etching processes (acid, alkaline, micro-etch) and ensure etch rate stability and uniformity
  • Optimize surface preparation steps prior to plating such as micro-etch, oxide removal, and plasma/aquatic cleaning
  • Monitor and sustain wet chemistry tanks (etchants,...

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