IC Package Design Engineer

Austin, TX, United States • Posted June 03, 2026

Job Type: Full-time
Location: Austin, TX
Posted: June 03, 2026
Category: other-general
Application Deadline: June 08, 2026

Role Description

**Role Number:** 200661052-0157

**Summary**
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for Apple’s internal and custom components across products including iPhone, iPad, Mac, Apple Watch, and Apple TV. We’re looking for a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. You will play a key role in shaping the architecture, scalability, and efficiency of next-generation products while advancing design methodologies through automation and AI.

**Description**
As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical design from concept through tape-out. You will collaborate closely with cross-functional teams to deliver optimized SI/PI performance across a wide range of silicon technologie...

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