IC Package Design Engineer

Walk-In Drive: IC Package Design Engineer (3 Years) Weekend Hiring Drive – HCLTech | Bangalore (Jigani Campus) HCLTech is hiring skilled professionals for the role of IC Package Design Engineer . If you have a passion for advanced package and PCB design, we invite you to attend our walk-in drive! Interview Details Date: 16 May 2026 (Saturday) Time: 9:00 AM – 2:00 PM Venue: Tower 4, GF café 3 , HCLTech, Jigani Campus, Bangalore Mode: Face-to-Face (F2F) SPOC: Mareeswari C M Role: IC Package Design Engineer Experience: 3 Years Key Responsibilities & Required Skills Strong experience in IC Package / Substrate Design (mandatory) Hands-on experience with Cadence APD (Allegro Package Designer) Good understanding of package/substrate design and assembly rules , especially for flip chip designs Exposure to various package technologies such as MCM, Flip-Chip, Wire Bond, 2.5D, 3D (added advantage) Expertise in high-speed complex package & PCB design , including: HDI Blind & Buried Via technol...