Imaging Package Design Engineer — High-Impact Tech

sevilla, andalucía, Spain • Posted June 06, 2026

Job Type: Full-time
Location: sevilla, andalucía
Posted: June 06, 2026
Category: Ingeniería y tecnología
Application Deadline: July 16, 2026

Role Description

A leading technology company is seeking a Package Design Engineer to lead the design of advanced microelectronic packages in Seville, Spain. The role involves identifying customer needs, implementing design solutions, and managing technical interactions with vendors. Candidates should have a background in microelectronics or electronics, with experience in packaging design and a strong command of English and French. This position offers innovative projects, a flexible work environment, and a commitment to work-life balance.
#J-18808-Ljbffr

Interested in this role?

Click the button below to start your application for Imaging Package Design Engineer — High-Impact Tech at Teledyne Technologies Incorporated.

Apply Now