Microelectronic System and Packaging Mold Flow Simulation Engineer

Taufkirchen, Bavaria, Germany • Posted May 22, 2026

Job Type: Full time

Location: Taufkirchen, Bavaria

Posted: May 22, 2026

Category: Engineers

Application Deadline: July 01, 2026

Role Description

onsemi is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in Germany. As a microelectronic system and packaging mold flow simulation engineer, you will have the opportunities to support new power module and system development and new product design, assembly and process, quality and reliability, and customers in worldwide.
Performance Objectives:

The successful candidate will have the opportunity to:
Mold flow simulation for thermal setting and thermoplastic in both transfer and injection molding.
Do thermal-mech simulation for microelectronic packaging and system, assembly process.
Analyze the voids, air tracks and NO filling defects in mold flow.
Analyze the Degree of Curing and its impact to mold material property and performance. 
Do analysis and correlation of mold flow results to measured data.
Develop and maintain the state of...
                

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