Onsite Process Engineer: Wire Bond & Die Attach

ipoh, perak, Malaysia • Posted May 25, 2026

Job Type: Full-time
Location: ipoh, perak
Posted: May 25, 2026
Category: Engineering
Application Deadline: July 04, 2026

Role Description

A global leader in engineering solutions is seeking candidates for an onsite position focused on managing production processes. Responsibilities include supporting DR8 Gen1.5 processes and improving yield through various quality checks. Ideal candidates should hold a Diploma in Science/Engineering, preferably in Electronics or Electrical, with experience in high volume manufacturing and excellent analytical skills. The job offers a competitive compensation program, adhering to company values of integrity, collaboration, and respect.
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