Optical Packaging Lead: Assembly & Process Innovation
, , malaysia, , , malaysia, Malaysia • Posted June 01, 2026
Job Type:
Full-time
Location:
, , malaysia, , , malaysia
Posted:
June 01, 2026
Category:
Engineering
Application Deadline:
July 11, 2026
Role Description
A leading technology firm in Malaysia is seeking a skilled process lead engineer for optical device packaging and assembly. The ideal candidate will have a Master's or Ph.D. in Mechanical Engineering, with a minimum of three years' relevant experience. You will lead assembly automation, support R&D, and work cross-functionally, ensuring project management excellence. The position promises competitive salary and benefits in a fast-paced, collaborative environment.
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