Package technology Reliability senior engineer/Technical manager
Hsinchu City, Taiwan Province, Taiwan • Posted May 30, 2026
Job Type:
Full-time
Location:
Hsinchu City, Taiwan Province
Posted:
May 30, 2026
Category:
Engineers
Application Deadline:
July 09, 2026
Role Description
Job Description1. New Product risk assessment on Substrate for 2.5D/3D/CPO advanced package & Board level qualification
2. Substrate electrical & physical analysis for Advanced Package
3. New product reliability concern engagement with customer
4. New assembly SBT supplier audit & qualification
5. Assembly supplier SBT quality & reliability management (Quality incident handling, PCN, regular audit, score card, etc.)
6. New product/technology introduction quality & reliability management
7. Assembly SBT supplier quality improvement projectRequirement1. MS degree (or above) in Material Science or Engineering.
2. Familiar with Assembly substrate processes.
3. Familiar with problem solving and 8D CAR methodology
4. VQA/IQA or MQR related experience
5. Package Substrate & Board level reliability qualification experience
2. Substrate electrical & physical analysis for Advanced Package
3. New product reliability concern engagement with customer
4. New assembly SBT supplier audit & qualification
5. Assembly supplier SBT quality & reliability management (Quality incident handling, PCN, regular audit, score card, etc.)
6. New product/technology introduction quality & reliability management
7. Assembly SBT supplier quality improvement projectRequirement1. MS degree (or above) in Material Science or Engineering.
2. Familiar with Assembly substrate processes.
3. Familiar with problem solving and 8D CAR methodology
4. VQA/IQA or MQR related experience
5. Package Substrate & Board level reliability qualification experience
Interested in this role?
Click the button below to start your application for Package technology Reliability senior engineer/Technical manager at MediaTek.
Apply Now