PR, Engineer, FE OCT CPEE ADT BOND

singapore, singapore, Singapore • Posted June 30, 2026

Job Type: Full-time
Location: singapore, singapore
Posted: June 30, 2026
Category: Other-General
Application Deadline: August 09, 2026

Role Description

Bonding Process & Equipment Engineer - Micron Technology

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As a Bonding Process & Equipment Engineer , you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer‑level bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding).

You will drive yield improvement, cost reduction, process capability enhancement, and risk management , while resolving complex manufa...

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