Process Engineer (Die bond)

Telok Panglima Garang, Malaysia, Malaysia • Posted June 06, 2026

Job Type: Full-time
Location: Telok Panglima Garang, Malaysia
Posted: June 06, 2026
Category: other-general
Application Deadline: June 11, 2026

Role Description

Process Engineer (Die bond)

Job Description

Assembly Process Engineering Team supports productions operations by resolving line issues and optimizing processes to meet Quality, Cost and Delivery target. The role also leads New Product Introduction (NPI), ensuring smooth transfer from design through qualification to mass production.

**Key Responsibilities**

+ Establish, optimize, and control manufacturing process conditions, including implementation of SPC and monitoring of key process indicators (yield, defect trends).
+ Lead New Product Introduction (NPI) activities from design transfer, process setup, qualification, sample builds, and ramp‑up to mass production.
+ Evaluate, qualify, and release new materials, equipment, and tooling in accordance with QMS requirements.
+ Troubleshoot process and equipment issues, control non‑conforming products, and implement corrective and preventive actions to prevent defect escape.
+ Drive yield impro...

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