Semiconductor Packaging Engineer

Job Description
An Insight Global client in Tucson, AZ is seeking a packaging engineer who comes from a process engineering background to join their team. This person will be responsible for process improvements to the company's wire/die bonding, oven vacuum and pick and place machine manufacturing process. The team currently has the front end of the process automated, but the backend is not currently automated - therefore a background and experience in setting up automated systems is critical as the team explores further automation. This person must have strong experience in Lean Six Sigma principles, root cause analysis, continuous improvement, and process SPC. This role does require the employee to be in-person in Tucson, AZ, but there is some day-to-day schedule flexibility as long as the job is getting completed. This role can pay between $90k and $100k and relocation assistance can be offered on a case-by-case basis. Exact compensation may vary based on education and experienc...