Senior Engineer, Packaging Engineering

bengaluru, karnataka, India • Posted June 09, 2026

Job Type: Full-time
Location: bengaluru, karnataka
Posted: June 09, 2026
Category: Other-General
Application Deadline: July 19, 2026

Role Description

Job Description

We are seeking a highly skilled Senior Engineer, Packaging Engineering to join our team in Bengaluru, India. In this role, you will lead semiconductor packaging technology for flash memory products.

  • Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified, and introduced into production in a timely manner while meeting all mechanical, electrical, performance, reliability, and quality requirements.        
  • Lead cross-functional teams, factories, and other engineers while managing the entire package life cycle process.          
  • Works with the Packaging R&D teams worldwide to develop and qualify new and emerging packaging technology required to support business needs
  • Support assembly yield improvement and package cost reduction programs.  
  • Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA, ...

Interested in this role?

Click the button below to start your application for Senior Engineer, Packaging Engineering at Sandisk.

Apply Now