Senior Microelectronic Packaging Design Engineer
ottawa, on, Canada • Posted June 01, 2026
Job Type:
Full-time
Location:
ottawa, on
Posted:
June 01, 2026
Category:
Other-General
Application Deadline:
July 11, 2026
Role Description
A leading technology firm in Ottawa is seeking a Microelectronic Packaging Design Engineer to support technology and product development programs. You will work with a team to design microelectronic packages and modules, ensuring compliance with product requirements. The ideal candidate has a Bachelor's Degree in Mechanical Engineering or similar, along with over 8 years of experience in hardware design, packaging, and tool proficiency. This role is significant for innovative projects in various emerging markets.
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