Senior Microelectronic Packaging Design Engineer

ottawa, on, Canada • Posted May 26, 2026

Job Type: Full-time
Location: ottawa, on
Posted: May 26, 2026
Category: Engineering
Application Deadline: July 05, 2026

Role Description

A leading technology firm in Ottawa is seeking a Microelectronic Packaging Design Engineer to support technology and product development programs. You will work with a team to design microelectronic packages and modules, ensuring compliance with product requirements. The ideal candidate has a Bachelor's Degree in Mechanical Engineering or similar, along with over 8 years of experience in hardware design, packaging, and tool proficiency. This role is significant for innovative projects in various emerging markets.
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