Senior Package Layout Engineer

Hsinchu, Taiwan, Taiwan • Posted June 02, 2026

Job Type: Full-time
Location: Hsinchu, Taiwan
Posted: June 02, 2026
Category: other-general
Application Deadline: June 07, 2026

Role Description

NVIDIA have some of the most forward-thinking and hardworking people in the world working for us and, due to unprecedented growth, our exclusive engineering teams are rapidly growing. If you're a creative and autonomous engineer with a real passion for technology, we want to hear from you.

NVIDIA IC Packaging design team is looking for a Senior IC Packaging Design Engineer to join our package team and focus on delivering and designing state of the art high-speed Interconnect systems for Supercomputers and Datacenters. This position will collaborate with Technical Package Lead and cooperation with different design teams and development of complex, detailed layout of IC substrates for NVIDIA products.


What you'll be doing:
+ As part of a Package Layout team, you will collaborate to implement high speed and PDN design for ASIC packages.
+ Develop symbols, pad stack and perform substrate package routing, placement, stack-up, reference plane, power distribution...

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