Senior Power Module Engineer – Embedded Packaging Expert

seremban, negeri sembilan, Malaysia • Posted June 04, 2026

Job Type: Full-time
Location: seremban, negeri sembilan
Posted: June 04, 2026
Category: Engineering
Application Deadline: July 14, 2026

Role Description

A leading electronics firm in Malaysia is seeking a Principal Product Engineer to lead product engineering activities for advanced power modules. This position involves developing next-generation technologies and ensuring manufacturability and quality. The ideal candidate should possess over 10 years in semiconductor product engineering and a strong background in power module development. Excellent communication and collaboration skills are essential as the role involves cross-functional teamwork. Join a company driving innovations in vehicle electrification and sustainable energy solutions.
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