Senior Power Module Engineer – Embedded Packaging Expert
seremban, negeri sembilan, Malaysia • Posted June 04, 2026
Job Type:
Full-time
Location:
seremban, negeri sembilan
Posted:
June 04, 2026
Category:
Engineering
Application Deadline:
July 14, 2026
Role Description
A leading electronics firm in Malaysia is seeking a Principal Product Engineer to lead product engineering activities for advanced power modules. This position involves developing next-generation technologies and ensuring manufacturability and quality. The ideal candidate should possess over 10 years in semiconductor product engineering and a strong background in power module development. Excellent communication and collaboration skills are essential as the role involves cross-functional teamwork. Join a company driving innovations in vehicle electrification and sustainable energy solutions.
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