Senior Power Module Engineer – Embedded Packaging Expert

seremban, negeri sembilan, Malaysia • Posted May 29, 2026

Job Type: Full-time
Location: seremban, negeri sembilan
Posted: May 29, 2026
Category: Engineering
Application Deadline: July 08, 2026

Role Description

A leading semiconductor company is seeking a Principal Product Engineer focused on High Power Modules for their New Product Development division. The ideal candidate will have over 10 years of experience in semiconductor product engineering and specialized expertise in power module development. Responsibilities include leading product engineering activities, executing prototype builds, and conducting failure analysis, while collaborating with global teams to ensure high performance and reliability in automotive-grade solutions.
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