Senior Power Module Packaging Engineer
seremban, negeri sembilan, Malaysia • Posted May 26, 2026
Job Type:
Full-time
Location:
seremban, negeri sembilan
Posted:
May 26, 2026
Category:
Engineering
Application Deadline:
July 05, 2026
Role Description
onsemi is looking for a skilled individual with over 8 years of experience in package technology development to lead new module development initiatives. The ideal candidate should have in-depth knowledge of power module packages and strong communication skills to effectively collaborate with teams. Responsibilities include ensuring adherence to technical requirements and driving problem-solving methodologies. A BS or MS degree is required, alongside proficiency in statistical software, Auto-CAD, and MS Office.
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