Senior Process Engineer (Plating)

Seremban, Negeri Sembilan, Malaysia • Posted June 07, 2026

Job Type: Full-time
Location: Seremban, Negeri Sembilan
Posted: June 07, 2026
Category: Engineers
Application Deadline: July 17, 2026

Role Description

About the Role

We are seeking a highly driven and technically strong Plating Process Engineer to lead sustaining and continuous enhancement initiatives across semiconductor packaging operations. This role plays a critical part in ensuring plating process stability, yield improvement, and high equipment performance to support advanced and high-volume manufacturing (HVM).

You will work closely with cross-functional teams including Equipment Engineering, R&D, NPI, Product Design, and Reliability to ensure plating capabilities meet evolving package architecture and technology requirements.

What You Will Do

  • Lead and manage sustaining activities and continuous improvement of plating processes across multiple semiconductor package platforms.

  • Conduct routine process capability and performance evaluations to ensure alignment with manufacturing standards.

  • Identify sources of process variation a...

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