SiC Wafer & Package Technology Development Engineer

Taufkirchen, Bavaria, Germany • Posted May 25, 2026

Job Type: Full time

Location: Taufkirchen, Bavaria

Posted: May 25, 2026

Category: Engineers

Application Deadline: July 04, 2026

Role Description

Technical and customer support for the qualification of SiC die sales and development. The candidate must have knowledge of package design, assembly processes and interactions with device.
Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals.
Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams.
Understand detailed customer requirements and verify latest technologies meet or exceed all expectations.
Document findings and process flows to create baseline for new technology platforms.
Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis.
Updates customer assembly application notes.

            

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