Sr Staff Package Design and Develop Engineer (Power package)
Ipoh, Perak, Malaysia • Posted June 05, 2026
Job Type:
Full-time
Location:
Ipoh, Perak
Posted:
June 05, 2026
Category:
Engineers
Application Deadline:
July 15, 2026
Role Description
Job Description
We are actively driving advanced package technology and developing power package with focusing on next generation technologies for AI data center and automotive. To achieve the rapidly growing demand and expedite release to market of power packages, we are developing such as Power QFN, HSON, HSOT and TOLL. This role offers the opportunity to work on, higher density, lower resistance, higher reliability, and high thermal dissipation package design and develop technologies.
Key Responsibilities
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