Sr. Technical Program Manager, Amazon Pay | Credit & Lending

Bengaluru, India, India • Posted June 03, 2026

Job Type: Full-time
Location: Bengaluru, India
Posted: June 03, 2026
Category: other-general
Application Deadline: June 08, 2026

Role Description

Description
Are you excited about building the future of digital lending at massive scale? Do you want to shape a greenfield lending platform that combines technology, compliance, risk, payments, accounting, and customer experience across emerging international markets?
The Credit & Lending team at Amazon Pay is building Amazon’s next-generation lending platform to enable seamless credit experiences for millions of customers across Latin America. This is a high-visibility, high-ownership role at the intersection of fintech innovation, large-scale distributed systems, regulatory compliance, and customer obsession.
As a Senior TPM, you will lead complex cross-functional programs spanning engineering, product, finance, tax, compliance, risk, legal, operations, and external financial partners. You will help define and drive the roadmap for Amazon’s in-house lending capabilities across LATAM markets, enabling scalable and reusable technology foundations for onboarding, underwriting...

Interested in this role?

Click the button below to start your application for Sr. Technical Program Manager, Amazon Pay | Credit & Lending at Amazon.

Apply Now