Staff Engineer, Packaging Engineering
Bengaluru, Karnataka, India • Posted June 04, 2026
Job Type:
full-time
Location:
Bengaluru, Karnataka
Posted:
June 04, 2026
Category:
Engineers
Application Deadline:
July 14, 2026
Role Description
Job Description
Our Package Design Engineering team is seeking a talented Staff Engineer with expertise in thermal management, based at our Bangalore site. In this role, you will be pivotal in driving innovation in thermal design for our high-performance flash products, as well as developing and maintaining advanced simulation tools.
ESSENTIAL DUTIES AND RESPONSIBILITIES:
- Work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
- Innovate thermal management solutions for high-performance flash products
- Enhance and maintain our modeling and simulation infrastructure to improve efficiency and accuracy across the design and manufacturing processes.
- This position may interface with package & product design, electrical, thermal and physical characterization, reliability testing, failure analysis, assembly R&a...
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