Staff Engineer, Packaging Engineering

Bengaluru, Karnataka, India • Posted June 04, 2026

Job Type: full-time
Location: Bengaluru, Karnataka
Posted: June 04, 2026
Category: Engineers
Application Deadline: July 14, 2026

Role Description

Job Description

Our Package Design Engineering team is seeking a talented Staff Engineer with expertise in thermal management, based at our Bangalore site. In this role, you will be pivotal in driving innovation in thermal design for our high-performance flash products, as well as developing and maintaining advanced simulation tools. 

ESSENTIAL DUTIES AND RESPONSIBILITIES:

  • Work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
  • Innovate thermal management solutions for high-performance flash products 
  • Enhance and maintain our modeling and simulation infrastructure to improve efficiency and accuracy across the design and manufacturing processes.
  • This position may interface with package & product design, electrical, thermal and physical characterization, reliability testing, failure analysis, assembly R&a...

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