Staff Package Design Engineer

Bengaluru, India, India • Posted June 06, 2026

Job Type: Full-time
Location: Bengaluru, India
Posted: June 06, 2026
Category: other-general
Application Deadline: June 11, 2026

Role Description

Staff Package Design Engineer

Job Description

**Job Description**

We are looking for a Package design Engineer to join our advanced silicon packaging design and simulation team and contribute to the design and delivery of high‑performance 2.5D/3D, chiplet‑based, FCBGA, SiP, wire bond and QFP/QFN packages used in industry‑leading products. The role requires strong technical depth in package layout execution, manufacturability, and cross‑domain co‑design with silicon, SI/PI, thermal, and reliability teams.

**Key Responsibilities**

+ Perform package layout design and development for advanced packages including 2.5D/3D IC, FCBGA, SiP, and multi‑chip modules.
+ Develop and maintain package CAD databases, ensuring accuracy and adherence to design guidelines, Design for Manufacturing (DFM), and Design for Assembly (DFA) requirements to ensure producibility.
+ Manage end-to-end design cycle, including schematic creation, netlist import, footpr...

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