Staff Packaging Engineer

The Role

Candidate is required to work closely with oSATs and cross‑functional teams to bring up and sustain for InFO, Bumping, EFB/CoWoS‑L, CoWoS‑S, WLFO, FCBGA, LGA and chiplet packages.

The Person

The ideal candidate will have a balanced mix of strong technical knowledge as well as program management experience in InFO, Bumping, EFB/CoWoS‑L, CoWoS‑S, WLFO, FCBGA, LGA and chiplet package functions.

The successful candidate must be a team player with a commitment to meeting deadlines, lead and drive solutions with an aptitude to thrive in a fast‑paced multi‑tasking environment, demonstrate excellent cross‑functional project management skills, strong interpersonal skills, and good communication & presentation skills. The candidate must have good command of both written and spoken English.

Key Responsibilities

• Responsible for InFO, Bumping, EFB/CoWoS‑L, CoWoS, WLFO, FCBGA, LGA and Chiplet package Manufacturing readiness f...