TPU power

Shanghai, Shanghai, China • Posted June 11, 2026

Job Type: Full-time

Location: Shanghai, Shanghai

Posted: June 11, 2026

Category: Engineers

Application Deadline: July 21, 2026

Role Description

Job Description
Design new high density power modules for CPU core power
New chips bring up, debug and road test.
Create demo boards/modules for new business opportunities.
Perform schematic and PCB layout reviews for customer projects.
Write product datasheet, applications note, user manual and other documents.
Participate in new chip/module definition and feasibility study.
设计新一代高功率密度的电源模块；
负责新芯片的测试和验证；
审阅客户的原理图和PCB Layout；
对客户的项目进行系统设计、优化与测试；
设计开发板并撰写相关的应用手册；
新一代芯片和功率模块的定义；

Qualifications
MSEE /BSEE with 5+ years experience in power management applications, such as multiphase buck converter, hybrid switched-capacitor converter, LLC converter, full bridge converter, etc. Experience in the power module is preferred.
With ability of analyzing power electronic circuit and good understanding of power electronics topology, control theory, coupled inductors and EMC;...
                

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