Technical Fellow, Advanced Packaging & HPC Strategy

ottawa, on, Canada • Posted June 06, 2026

Job Type: Full-time

Location: ottawa, on

Posted: June 06, 2026

Category: Other-General

Application Deadline: July 16, 2026

Role Description

                    A leading semiconductor intelligence firm is looking for a Technical Fellow in Ottawa to shape the technical direction for Advanced Packaging and High Performance Computing. This role involves being a subject matter expert, guiding the evolution of technology roadmaps, and leveraging AI tools for analysis. Ideal candidates will have a Master's or PhD with 10+ years in semiconductor-related fields, skilled in advanced packaging and system-level performance. Join a team committed to innovation and inclusivity.
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