Wafer Backside Processing Technician

Goleta, CA, United States • Posted May 29, 2026

Job Type: Full-time
Location: Goleta, CA
Posted: May 29, 2026
Category: other-general
Application Deadline: June 09, 2026

Role Description

**Be visionary**

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

**Job Description**

**Job Summary:**

This candidate will perform a variety of technical tasks associated with backside wafer processing and assembly operations. This role supports production and engineering priorities in a cleanroom environment, focusing on die preparation, hybridization, wicking, and wire bonding processes.

This position will be a 2nd Shift position with hours Monday's thr...

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