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Wafer Qualification, Reliability and Failure Analysis Engineering

Singapore, Singapore, Singapore • Posted June 18, 2026

Job Type: Full time
Location: Singapore, Singapore
Posted: June 18, 2026
Category: Engineers
Application Deadline: July 28, 2026

Role Description

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Job Description:

  • Provide leadership and insights into root cause of device failures via in-depth failure analysis using intricate tools and state of the art equipment.
  • Collaborate with product engineering and R&D team to translate findings into solutions for new design improvements.
  • Monitor and use big data analysis on long term wafer reliability performance and propose improvements to product design or manufacturing process changes.

    • Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical conditi...

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